By 2015, LED packaging manufacturers expansion to accelerate the pace, merger integration become the industry norm, LED packaging market, intense competition, 2015 device price almost halved.

 

2016, Q1 package device prices steady rise, the output growth accelerated in 2016, flip COB, CSP package into a hot market.

 

It is understood that the LED technology roadmap to the development of the CSP phase, which is a kind of upgrade and change because of the LED package structure, in order to solve the problem of light receiving angle, reliability, brightness, strength of the traditional LED package.

 

"Flip, CSP is the two most popular, these two technologies are not parallel packaging technology, but cross and fusion. On behalf of the installation of flip chip electrode, CSP on behalf of the body relative to the size of the chip package." Xiao Guowei Crystal Electronics President mentioned.

 

"The CSP in backlight applications, so it is applied widely. And in the lighting industry is still not to the price, then perhaps we should also thank the lamps and lanterns factory for the cost of continuous compression in packaging factory after the revolt, SMD products suddenly and have a way to SMD two years ago the price of CSP and perhaps replace the advantage, but to currently such low prices have to too much significance." Xiao Guowei said.

 

Enterprise members agreed that the flip chip technology in high power place, CSP depends mainly on flip chip technology to realize, the flip chip CSP in the short term will not replace SMD, EMC package structure, but the flip chip CSP future in high power market will have certain advantages and scale.